See Pricing and Request a Quote
Industries
Some of the industries we serve...
Here is a list of key industries we serve. Please contact us if you do not see your industry listed. With our comprehensive experience and capabilities, there is no limit to what we can do for you.
Services
Our Top Services
Lock‐in Amplifier Augmented OBIC
This technique conditions the OBIC signal through a lock‐in amplifier significantly improving the signal‐to‐noise ratio and the overall detection capabilities of the system. This technique is ca..
View all servicesLaser Assisted Device Alteration (LADA)
Laser assisted device alteration (LADA) is an advanced laser injection fault isolation technique utilized when static fault isolation techniques are not successful in isolation a failure mechanism. LA..
View all servicesLock‐in Thermography
Our lockin thermography tool utilizes a medium wave infrared (MWIR) thermal imaging camera coupled with a lock‐in modulation system for optimized thermal sensitivity. This technique is used to ident..
View all servicesPCB Design and Layout
With our electronic design automation (EDA) suite we are able to cover all your electronic computer animated design (ECAD) and mechanical computer animated design (MCAD) requirments. We work with you ..
View all servicesLow Power Optical Microscopy
To perform low power optical microscopy, we utilize a Nikon SMZ stereo zoom optical microscope for its excellent low magnification optical technology. There are a number of attributes which make this ..
View all servicesHigh Power Reflected Optical Microscopy
High power optical microscopy is performed with an Olympus BX60 high power compound optical microscope body. Known and recognized for its Y shaped design the BX series of Olympus microscopes offer sup..
View all servicesScanning Acoustic Microscopy (SAM)
Unlock the Secrets of Your Materials with Non-Destructive Power: Imagine a world where you could peer inside any object, without ever breaking it open. With Scanning Acoustic Microscopy (SAM), that w..
View all servicesArea Defined Backside Preparation
As integrated circuit technologies shrink and metal layers increase the density of the integrated circuit layouts negatively impacting efficacy of typical fault isolation techniques. Photons generated..
View all servicesArea Defined Die Thinning
Under specialized cases, rather than globally thinning a semiconductor substrate it is desirable to thin an isolated defined area of the semiconductor substrate. Some cases where this technique might ..
View all servicesPackage Decapsulation
The first step in microelectronic die level fault isolation is the destructive step of microelectronic package decapsulation. For clarification, the term destructive refers to a procedural step where ..
View all servicesPhoton Emission Microscopy
Photon emission microscopy (PEM) is a fault isolation technique which, like many analytical techniques, is recognized by various names and acronyms. The moniker photon emission microscopy is synonymou..
View all servicesExternally Induced Voltage Alteration (XIVA)
Eternally induced voltage alteration (XIVA™) is a very effective laser injection fault isolation technique used to localize ohmic type defects and damage. XIVA™ is effective in localizing the foll..
View all servicesLock‐in Amplifier Augmented XIVA
Lock-in augmented XIVA significantly improves the sensitivity of the system through the implementation of a lock-in amplifier. The lock-in amplifier modulates the laser signal while sampling the outpu..
View all servicesSoft Defect Localization (SDL)
Soft defect localization (SDL) is an advanced fault isolation technique used to isolate functional failures induced by ohmic related defects, damage, or degradation. SDL would be applied when a failur..
View all servicesOptical Beam Induced Current (OBIC)
Optical beam induced current (OBIC) is a laser signal fault isolation technique used to isolate defects and damage in semiconductor materials. OBIC is effective in isolating failure mechanisms related..
View all servicesLock‐in Amplifier Augmented OBIC
This technique conditions the OBIC signal through a lock‐in amplifier significantly improving the signal‐to‐noise ratio and the overall detection capabilities of the system. This technique is ca..
View all servicesLaser Assisted Device Alteration (LADA)
Laser assisted device alteration (LADA) is an advanced laser injection fault isolation technique utilized when static fault isolation techniques are not successful in isolation a failure mechanism. LA..
View all servicesLock‐in Thermography
Our lockin thermography tool utilizes a medium wave infrared (MWIR) thermal imaging camera coupled with a lock‐in modulation system for optimized thermal sensitivity. This technique is used to ident..
View all servicesPCB Design and Layout
With our electronic design automation (EDA) suite we are able to cover all your electronic computer animated design (ECAD) and mechanical computer animated design (MCAD) requirments. We work with you ..
View all servicesLow Power Optical Microscopy
To perform low power optical microscopy, we utilize a Nikon SMZ stereo zoom optical microscope for its excellent low magnification optical technology. There are a number of attributes which make this ..
View all servicesHigh Power Reflected Optical Microscopy
High power optical microscopy is performed with an Olympus BX60 high power compound optical microscope body. Known and recognized for its Y shaped design the BX series of Olympus microscopes offer sup..
View all servicesScanning Acoustic Microscopy (SAM)
Unlock the Secrets of Your Materials with Non-Destructive Power: Imagine a world where you could peer inside any object, without ever breaking it open. With Scanning Acoustic Microscopy (SAM), that w..
View all servicesArea Defined Backside Preparation
As integrated circuit technologies shrink and metal layers increase the density of the integrated circuit layouts negatively impacting efficacy of typical fault isolation techniques. Photons generated..
View all servicesArea Defined Die Thinning
Under specialized cases, rather than globally thinning a semiconductor substrate it is desirable to thin an isolated defined area of the semiconductor substrate. Some cases where this technique might ..
View all servicesPackage Decapsulation
The first step in microelectronic die level fault isolation is the destructive step of microelectronic package decapsulation. For clarification, the term destructive refers to a procedural step where ..
View all servicesPhoton Emission Microscopy
Photon emission microscopy (PEM) is a fault isolation technique which, like many analytical techniques, is recognized by various names and acronyms. The moniker photon emission microscopy is synonymou..
View all servicesExternally Induced Voltage Alteration (XIVA)
Eternally induced voltage alteration (XIVA™) is a very effective laser injection fault isolation technique used to localize ohmic type defects and damage. XIVA™ is effective in localizing the foll..
View all servicesLock‐in Amplifier Augmented XIVA
Lock-in augmented XIVA significantly improves the sensitivity of the system through the implementation of a lock-in amplifier. The lock-in amplifier modulates the laser signal while sampling the outpu..
View all servicesSoft Defect Localization (SDL)
Soft defect localization (SDL) is an advanced fault isolation technique used to isolate functional failures induced by ohmic related defects, damage, or degradation. SDL would be applied when a failur..
View all servicesOptical Beam Induced Current (OBIC)
Optical beam induced current (OBIC) is a laser signal fault isolation technique used to isolate defects and damage in semiconductor materials. OBIC is effective in isolating failure mechanisms related..
View all servicesLock‐in Amplifier Augmented OBIC
This technique conditions the OBIC signal through a lock‐in amplifier significantly improving the signal‐to‐noise ratio and the overall detection capabilities of the system. This technique is ca..
View all servicesLaser Assisted Device Alteration (LADA)
Laser assisted device alteration (LADA) is an advanced laser injection fault isolation technique utilized when static fault isolation techniques are not successful in isolation a failure mechanism. LA..
View all servicesLock‐in Thermography
Our lockin thermography tool utilizes a medium wave infrared (MWIR) thermal imaging camera coupled with a lock‐in modulation system for optimized thermal sensitivity. This technique is used to ident..
View all servicesPCB Design and Layout
With our electronic design automation (EDA) suite we are able to cover all your electronic computer animated design (ECAD) and mechanical computer animated design (MCAD) requirments. We work with you ..
View all services
INVESTMENT OPPORTUNITY
Become Our Partner
Collaboration and equity are key values we engender with our team members, customers, and business partners, making Watson Analytical a favorable investment. We are perpetually expanding our services and market coverage. Contact us to initiate exploration of partnership opportunities.
Latest Blog Posts
Conquer Uncertainty: Why Agile Agility and Proactive Solutions Make Us Your Innovation Partner
In today's dynamic market, agility is the lifeblood of success. Companies with the ability to pivot quickly and embrace change stand out from the pack. At Watson Analytical, we're not just nimble – ..