The demands of this industry are nearly in all cases mission critical meaning there is no room for compromise and no room to get it wrong. With experience in submarine communication systems, radar absorbent materials, flight control systems, missile systems, satellite technologies, and more, we have the expertise needed to ensure success and accountability.
- Low Power Optical Microscopy
- High Power Reflected Optical Microscopy
- Scanning Acoustic Microscopy (SAM)
- Area Defined Backside Preparation
- Area Defined Die Thinning
- Package Decapsulation
- Photon Emission Microscopy
- Externally Induced Voltage Alteration (XIVA)
- Lock‐in Amplifier Augmented XIVA
- Lock‐in Amplifier Augmented OBIC
- Soft Defect Localization (SDL)
- Optical Beam Induced Current (OBIC)
- Laser Assisted Device Alteration (LADA)
- Lock‐in Thermography
- Cross-Sectioning Services
- PCB Design and Layout


