Cross-Sectioning Services for Semiconductor Devices, PCBAs, and Electronic Components
Watson Analytical provides precision cross-sectioning services for semiconductor devices, printed circuit board assemblies (PCBAs), connectors, electronic components, and advanced materials. Our laboratory prepares high-quality cross-sections for failure analysis, process verification, quality assurance, and manufacturing defect characterization using precision cutting, mounting, grinding, polishing, and microscopic analysis.
Whether you need a single cross-section to investigate a field failure or a statistically significant sample set for process qualification, our engineers deliver rapid turnaround, detailed documentation, and accurate results.
Why Cross-Sectioning?
Cross-sectioning reveals internal structures that cannot be evaluated using external inspection alone. By exposing a precise slice through a component, engineers can examine interfaces, material thicknesses, bond quality, plating integrity, and manufacturing defects with exceptional detail.
Cross-section analysis is commonly used to:
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Root cause failure analysis
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Manufacturing process verification
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Reliability investigations
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Supplier qualification
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Incoming quality inspection
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Design verification
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Materials characterization
- Product development
Components We Analyze
- Semiconductor Packages
- Bare Die
- Flip Chip Devices
- Wire Bond Devices
- Leadframe Packages
- BGA Packages
- QFN Packages
- Ceramic Packages
- PCB Assemblies
- HDI Circuit Boards
- Flex Circuits
- Connectors
- Relays
- Sensors
- MEMS Devices
- Power Modules
- Battery Components
- Welded Assemblies
- Coatings
- Electronic Materials
Cross-Section Analysis Capabilities
- Precision cutting
- Vacuum mounting
- Cold mounting
- Precision grinding
- Multi-stage polishing
- Mirror finish polishing
- Optical microscopy
- Digital image capture
- SEM imaging
- EDS elemental analysis
- Grain structure analysis
- Void analysis
- Crack analysis
- Delamination analysis
- Corrosion analysis
- Plating thickness measurement
- Solder joint inspection
- Wire bond evaluation
- Die attach evaluation
- Intermetallic compound (IMC) analysis
Industries Served
- Semiconductor
- Aerospace
- Defense
- Automotive
- Medical Devices
- Consumer Electronics
- Telecommunications
- Industrial Electronics
- Power Electronics
Why Watson Analytical?
- ISO 9001 Certified
- ITAR Registered
- Rapid Turnaround
- Detailed Engineering Reports
- Decades of Failure Analysis Experience
- Advanced Microscopy Capabilities
- Semiconductor Specialists
- Engineering Consultation Available
What is cross-sectioning?
Cross-sectioning is the process of cutting, mounting, polishing, and examining a component to expose its internal structure for microscopic analysis.
What types of components can be cross-sectioned?
We routinely analyze semiconductor devices, PCB assemblies, connectors, electronic components, welds, coatings, plated structures, and advanced materials.
When is cross-sectioning used?
Cross-sectioning is commonly used during failure analysis, quality assurance, reliability testing, manufacturing process verification, and product development.
What defects can cross-sectioning reveal?
Cross-sectioning can identify:
- Cracks
- Voids
- Delamination
- Corrosion
- Insufficient plating
- Solder defects
- Wire bond defects
- Die attach defects
- Material contamination
- Manufacturing anomalies
Can cross-sections be analyzed with SEM?
Yes. Cross-sections can be examined using optical microscopy, scanning electron microscopy (SEM), and energy-dispersive X-ray spectroscopy (EDS) to provide high-resolution imaging and elemental composition analysis.