- Low Power Optical Microscopy
- High Power Reflected Optical Microscopy
- Scanning Acoustic Microscopy (SAM)
- Area Defined Backside Preparation
- Area Defined Die Thinning
- Package Decapsulation
- Photon Emission Microscopy
- Externally Induced Voltage Alteration (XIVA)
- Lock‐in Amplifier Augmented XIVA
- Lock‐in Amplifier Augmented OBIC
- Soft Defect Localization (SDL)
- Optical Beam Induced Current (OBIC)
- Laser Assisted Device Alteration (LADA)
- Lock‐in Thermography
- Cross-Sectioning Services
- PCB Design and Layout
