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Header Watson Analytical Logo
760-271-3989
Get A Quote
  • Home
  • Services
    • Low Power Optical Microscopy
    • High Power Reflected Optical Microscopy
    • Scanning Acoustic Microscopy (SAM)
    • Area Defined Backside Preparation
    • Area Defined Die Thinning
    • Package Decapsulation
    • Photon Emission Microscopy
    • Externally Induced Voltage Alteration (XIVA)
    • Lock‐in Amplifier Augmented XIVA
    • Lock‐in Amplifier Augmented OBIC
    • Soft Defect Localization (SDL)
    • Optical Beam Induced Current (OBIC)
    • Laser Assisted Device Alteration (LADA)
    • Lock‐in Thermography
    • Cross-Sectioning Services
    • PCB Design and Layout
  • Applications
    Product DebugSemiconductor Product CharacterizationBiomedical Device AnalysisCounterfeit AnalysisConstruction AnalysisProduct Reliability TestingMaterials CharacterizationCustom Test SolutionsCustom Debug and Analysis SolutionsLitigative/InvestigativeLab DesignTraining
  • Industries
    AerospaceAutomotiveElectronicsBiomedicalSemiconductor
  • Blogs
  • About us
  • Home
  • Blogs
  • About us

  • Low Power Optical Microscopy
  • High Power Reflected Optical Microscopy
  • Scanning Acoustic Microscopy (SAM)
  • Area Defined Backside Preparation
  • Area Defined Die Thinning
  • Package Decapsulation
  • Photon Emission Microscopy
  • Externally Induced Voltage Alteration (XIVA)
  • Lock‐in Amplifier Augmented XIVA
  • Lock‐in Amplifier Augmented OBIC
  • Soft Defect Localization (SDL)
  • Optical Beam Induced Current (OBIC)
  • Laser Assisted Device Alteration (LADA)
  • Lock‐in Thermography
  • Cross-Sectioning Services
  • PCB Design and Layout

  • Product Debug
  • Semiconductor Product Characterization
  • Biomedical Device Analysis
  • Counterfeit Analysis
  • Construction Analysis
  • Product Reliability Testing
  • Materials Characterization
  • Custom Test Solutions
  • Custom Debug and Analysis Solutions
  • Litigative/Investigative
  • Lab Design
  • Training

  • Aerospace
  • Automotive
  • Electronics
  • Biomedical
  • Semiconductor
Header Watson Analytical Logo
760-271-3989
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Blogs

Our team has a sincere ambition and interest for the tools, processes, suppliers, and technical leaders which serve our industry. The blog is a collaborative space we use to share information on all these subjects and more.

SEM cross-section showing semiconductor device layers — Watson Analytical FA Lab
May. 6, 2026

Cross-Sectioning Techniques in Semiconductor & Microelectronics Failure Analysis

Become our partner — Watson Analytical
Dec. 17, 2023

Conquer Uncertainty: Why Agile Agility and Proactive Solutions Make Us Your Innovation Partner

Appleseed referral program illustration
Oct. 29, 2021

Plant the seed and reap the rewards: The Appleseed Program

Emerging from the chrysalis — Watson Analytical rebrand
Jul. 10, 2021

Emerging From the Chrysalis: Watson Analytical

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A unique product resulting from the culmination of design, characterization and debug financially manageable for companies small and large.

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  • About Us

Services

  • Low Power Optical Microscopy
  • High Power Reflected Optical Microscopy
  • Scanning Acoustic Microscopy (SAM)
  • Area Defined Backside Preparation
  • Area Defined Die Thinning
  • Package Decapsulation
  • Photon Emission Microscopy
  • Externally Induced Voltage Alteration (XIVA)
  • Lock‐in Amplifier Augmented XIVA
  • Lock‐in Amplifier Augmented OBIC
  • Soft Defect Localization (SDL)
  • Optical Beam Induced Current (OBIC)
  • Laser Assisted Device Alteration (LADA)
  • Lock‐in Thermography
  • Cross-Sectioning Services
  • PCB Design and Layout

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  • 760-271-3989

Email

  • info@watsonanalytical.com
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