Printed circuit board assemblies (PCBAs) fail at the interfaces: solder joints, vias, laminate, and the components mounted on them. Watson Analytical provides board-level failure analysis for PCBAs, connectors, and passive and active components, combining non-destructive inspection with cross-sectioning and materials analysis to find the root cause and support corrective action with your contract manufacturer or supplier.
This work is also referred to as PCBA failure analysis, board-level failure analysis, and electronic assembly failure analysis.
Common PCBA Failure Modes
- Solder joint defects: fatigue cracking, BGA voiding, head-in-pillow, non-wets, and brittle intermetallics.
- Laminate and via failures: barrel cracks, pad cratering, delamination, and conductive anodic filament (CAF) growth.
- Corrosion and contamination: dendritic growth, flux and process residues, and leakage paths.
- Component failures: cracked ceramic capacitors, connector and contact failures, and IC failures traced back to the die.
- Electrical overstress: ESD and EOS damage to components and traces.
Our Board-Level Analysis Approach
- Optical inspection to document visible damage, residues, and workmanship.
- X-ray inspection of hidden joints, BGA voiding, and via structures.
- Modulated thermography to locate shorts and leakage on powered boards.
- Acoustic microscopy for delamination in components and laminate.
- Cross-sectioning of solder joints, vias, and components to confirm the failure mechanism.
- SEM/EDX and FTIR for intermetallics, corrosion products, and residues.
From Board to Die
When a board failure traces to an IC, the same lab continues the analysis to the die with semiconductor fault isolation and decapsulation, so you get one answer instead of a hand-off between labs. Suspect components can also be screened through counterfeit analysis.
Frequently Asked Questions
How do you find a short on a PCB assembly?
Modulated thermography detects the small temperature rise at a short or leakage path on a powered board, and X-ray and cross-sectioning then confirm the physical cause.
Can you analyze BGA solder joints without removing the part?
Yes. X-ray shows voiding and bridging non-destructively, and cross-sectioning through the joint confirms cracks and intermetallic condition.
Request PCBA Failure Analysis
Watson Analytical is an ISO 9001:2015 certified, ITAR-registered failure analysis laboratory in San Diego, California. Contact us to discuss your board failure and request a quote.