Scanning electron microscopy (SEM) with energy-dispersive X-ray spectroscopy (EDX) provides high-resolution imaging and elemental analysis for failure analysis and materials characterization. SEM reveals features far beyond the resolution of optical microscopy, and EDX identifies the elements present at a defect, contaminant, or interface.
SEM/EDX is also referred to as SEM/EDS, SEM-EDX analysis, and electron microscopy with elemental analysis.
Applications
- Die surface and defect imaging after decapsulation or delayering
- Cross-section imaging of interfaces, layers, and voids
- Elemental identification of contamination and foreign material
- Corrosion product analysis
- Solder joint and intermetallic compound (IMC) analysis
- Wire bond and flip-chip bump evaluation
- Plating thickness and composition
- Fracture surface examination
- Die and construction comparison for counterfeit analysis
How SEM Works
A focused electron beam scans the sample surface, and detectors collect the signals produced at each point. Secondary electrons reveal surface topography in fine detail, while backscattered electrons provide compositional contrast, with heavier elements appearing brighter. Together, they let analysts see defects, grain structure, and material boundaries at magnifications well beyond optical microscopy.
How EDX Works
The electron beam also generates X-rays with energies characteristic of the elements in the sample. EDX measures these X-rays to identify and semi-quantify elemental composition. Analysis can be performed as:
- Point analysis: the composition of a specific particle, defect, or feature.
- Line scans: composition profiles across interfaces and layers.
- Elemental mapping: the spatial distribution of each element across an area.
SEM/EDX and FTIR: Complete Contamination Identification
EDX identifies elements, which is ideal for metals, salts, and inorganic residues. It cannot identify organic compounds such as polymers, adhesives, flux residues, or oils. Fourier transform infrared spectroscopy (FTIR) identifies those organic materials by their molecular structure. Used together, SEM/EDX and FTIR provide complete identification of debris and contamination.
Turnaround and Deliverables
Typical turnaround for SEM/EDX analysis is 2 to 3 days. Results are documented with annotated SEM images, EDX spectra, and elemental maps in an engineering report.
Related Services
- FTIR Contamination Analysis
- Cross-Sectioning Services
- Focused Ion Beam (FIB) Analysis
- IC Delayering and Deprocessing
- Package Decapsulation
Frequently Asked Questions
Is EDX the same as EDS?
Yes. EDX (energy-dispersive X-ray spectroscopy) and EDS (energy-dispersive spectroscopy) are two names for the same elemental analysis technique.
Can EDX identify organic contamination?
Only partially. EDX detects elements such as carbon and oxygen but cannot identify the specific organic compound. FTIR is used to identify polymers, adhesives, flux residues, and other organic materials.
When is SEM used instead of optical microscopy?
SEM is used when features are smaller than the roughly 0.25 µm resolution limit of optical microscopy, when greater depth of field is needed, or when elemental analysis is required.
Can non-conductive samples be analyzed?
Yes. Non-conductive samples are prepared with a thin conductive coating or imaged under low-voltage conditions to prevent charging.
How long does SEM/EDX analysis take?
Typical turnaround is 2 to 3 days.
Request SEM/EDX Analysis
Watson Analytical is an ISO 9001:2015 certified, ITAR-registered failure analysis laboratory in San Diego, California, serving semiconductor, defense, space, biomedical, and litigation customers. Contact us to discuss your samples and request a quote.