X-ray radiographic inspection uses X-rays to image the internal structure of components and assemblies without opening or damaging them. It reveals wire bonds, die attach, solder joints, and internal package construction, making it a standard non-destructive step in failure analysis, counterfeit screening, and assembly quality evaluation.
X-ray inspection is also referred to as radiographic examination, radiography, and X-ray imaging.
Defects and Features X-ray Inspection Reveals
- Broken, lifted, or swept wire bonds
- Die attach voids
- BGA and solder joint voids, bridging, and opens
- Internal cracks and foreign material
- Leadframe, die size, and internal construction differences in suspect counterfeit parts
- Connector pin and plated-through-hole defects in PCB assemblies
- Missing, misplaced, or misaligned components
How X-ray Inspection Works
X-rays pass through the sample and are absorbed in proportion to the density and thickness of each material. Dense materials such as gold wire, copper, and solder absorb more X-rays and appear dark, while mold compound and laminate appear light. The resulting image shows the internal structure in high contrast.
Our system captures images in three dimensions using angled views of the sample, which separates overlapping features such as stacked wire bonds or double-sided board assemblies and helps locate defects in depth. It does not perform computed tomography (CT) reconstruction.
When to Use X-ray Inspection
X-ray inspection is performed early in the failure analysis workflow, alongside external visual inspection and scanning acoustic microscopy, before any destructive preparation. X-ray and SAM are complementary: X-ray shows dense structures such as wire bonds and solder, while SAM shows interface conditions such as delamination that X-ray cannot detect. X-ray inspection is also a standard element of counterfeit component inspection programs.
Turnaround and Deliverables
Typical turnaround for X-ray inspection is 2 to 3 days. Results are documented with annotated radiographic images in an engineering report.
Related Services
- Scanning Acoustic Microscopy (SAM)
- Low Power Optical Microscopy
- Cross-Sectioning Services
- Package Decapsulation
Frequently Asked Questions
Is X-ray inspection the same as radiographic examination?
Yes. Radiographic examination, radiography, and X-ray inspection all refer to imaging the internal structure of a part using X-rays.
What is the difference between X-ray inspection and acoustic microscopy?
X-ray images density differences, so it shows wire bonds, solder, and metal structures. Acoustic microscopy images interfaces, so it shows delamination and voids at bonded surfaces. The two techniques are often used together.
Can X-ray inspection damage sensitive devices?
For most components, inspection-level X-ray exposure has no effect. Some radiation-sensitive devices, such as certain non-volatile memories, can be affected by cumulative dose, so exposure is kept to the minimum needed for the inspection.
Do you offer X-ray CT?
Our system provides three-dimensional angled views but does not perform full CT reconstruction. For most package and board inspections, angled views separate overlapping features sufficiently to locate defects.
Request X-ray Inspection
Watson Analytical is an ISO 9001:2015 certified, ITAR-registered failure analysis laboratory in San Diego, California, serving semiconductor, defense, space, biomedical, and litigation customers. Contact us to discuss your components and request a quote.